Precision glass processing supports the trend towards heterogeneous integration
Due to its properties, glass is one of the most interesting materials for many areas of Advanced IC and Wafer Level Packaging. For a long time, it was considered very difficult to process. Production-related surface defects have given glass the reputation of being susceptible to brittle fracture and thus at best suitable for simple packaging tasks. "Thanks to Laser Induced Deep Etching technology (LIDE), it is possible for the first time to create deep microstructures in glass without causing microcracks, stresses or other surface defects. Machining is extremely precise and the process is fast. With the use of LIDE-processed glass, even more is possible in heterogeneous integration in advanced IC and wafer level packaging than before".
The information from the lecture on the LIDE process and the possibilities it opens up for microsystems technology can be found in a compact for-mat on the Vitrion homepage: www.vitrion.com