News & Press

LPKF press section –
news and image archive

Press Releases Archive

Here we have listed our announcements on new technologies and products from 2021 and older.

The archive for IR corporate news from 2021 and older can be found here.

Flip-chip (fc) package-on-package (PoP) using AMP

Functionalization of epoxy mold compounds (EMCs): AMP technology converts passive EMC into an active car-rier of electrical functionality.


Karlsruhe Institute of Technology (KIT) acquires LPKF ProtoLaser R4

The LPKF ProtoLaser R4 is a highly specialized precision picosecond laser system…

Time and cost savings thanks to digitalization

LPKF relies on digitalization for actively counteracting the current travel restrictions and complying…

Highest process stability and short cycle times in laser plastic welding thanks to DCD

Ensuring a uniform contact pressure during laser welding of…

A solid connection: Laser plastic welding with LPKF systems

Plastics are the ideal materials for many devices and their compo-nents: they are easy to…

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