LPKF MultiPress S4 for Multilayer PCBs

With the new LPKF MultiPress S4, LPKF is adding rigid, rigid-flex, flex, and RF materials to its range of capabilities for in-house production of multilayer prototypes. The new system inherits the intuitive graphical user interface of the predecessor system and is additionally equipped with a vacuum function and a fume extraction unit. With it, PCBs with up to eight layers and a thickness of up to 4 mm can be produced.

Lars Führmann, Product Manager for Prototyping Systems, explains: “The vacuum function makes a key contribution to the process reliability. It reduces the occurrence of air pockets and enables eight, instead of six, layers to be produced.” Thanks to an exhaust connection, vapors and fumes can be discharged to existing ventilation systems.

The LPKF MultiPress S4 is designed as a standalone system but has rollers allowing it to be positioned variably. It can use five temperature and pressure profiles, including ramp temperature and rapid cooling, in the process. The profiles are stored for predefined multilayer stackups and loaded right from the PC. 

 

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