At the electronica in Munich from November 12th to 15th you will find LPKF in Hall B1 at booth 219. At this leading trade fair for the electronics industry, LPKF is represented with many technologies: PCB prototyping, laser depaneling, stencil cutting, laser plastic welding, micro-machining of glass substrates and contract manufacturing. This year, LPKF is showing its entire portfolio of solutions for the industry - a good opportunity for interested parties to discuss different solution approaches with specialists. PCB prototyping is represented by the ProtoMat S104, the ProtoLaser U4 and sophisticated sample applications.
There's no doubt about it: LPKF is in the right place at the Space Tech Expo Europe from November 19th to 21st in Bremen. At booth Y18 in hall 7, LPKF will be presenting its ProtoLaser R4 - a specialist for demanding materials.
With the specialized picosecond laser, this system is suitable for the gentle processing of thermally sensitive materials as well as for cutting or removing ceramic materials, ablating transparent thin films or removing metal layers from plastic films. Double-sided RF structures on thin, flexible carriers? No problem.
Thanks to intuitive system software with comprehensive process and material libraries, demanding laboratory jobs can be implemented optimally in the shortest possible time. A visit on site is worthwhile: specialized application engineers are happy to answer questions about product layouts and materials.