Processing of electroplated GaN substrates in a single process step
As a replacement for silicon, gallium nitride ceramic substrate is increasingly used in components for power electronics, radar applications, 5G and satellite communications. However, the material poses a challenge for traditional material processing. The substrate is usually coated with micrometer-thin layers of metal - typically gold - which protects it from damage. Given the very different properties of the two materials, processing is traditionally done in two steps: Cutting the ceramic substrate and etching the metal layers.
However, the LPKF ProtoLaser R4 laser system can quickly process both material layers in a single, contactless and chemical-free process. The tolerances of traditional production steps are met or outperformed without the need for final cleaning of the material. The result is shorter throughput times for the production of small series or individual samples. Learn more and read an article in the Microwave Journal.