Complex glass processing with the LPKF ProtoLaser R4
When structuring glass, processing steps must not damage the surrounding structure – ideal for processing with ultra-short pulse lasers.
The LPKF ProtoLaser R4 works with laser pulses in the picosecond range at a wavelength of 515 nm. For Laboratory purpose ist can engrave, cut and thus also drill glass substrates. Circles of any diameter or free contours are cut out by the help of the LPKF Software. If only a defined layer thickness is removed, engravings are created with a precision of a few nanometers ¬¬– new areas of application in physics, chemistry, and biology. Appropriate system parameters ensure ablation without thermal effects in and on the glass. Even the optical properties of the glass substrate remain practically intact.
Surface coatings on glass substrates are removed with an accuracy of approx. 10 µm. This applies to thick or thin layers without affecting the glass substrate.
