Inhouse Multilayer PCB Manufacturing: LPKF demonstrates complete workflow at embedded world 2026
At this year's embedded world exhibition in Nuremberg, LPKF Laser & Electronics SE demonstrated how developers can manufacture multilayer printed circuit boards quickly and efficiently in their own lab. Jan-Hendrik Guttmann, Sales Manager PCB Prototyping at LPKF, showed in his presentation "Inhouse Multilayer PCBs – fast and simple" how the entire manufacturing process – from simple prototypes to eight-layer multilayers – can be realized in-house.
The 3-Step Workflow for Multilayer Manufacturing
Guttmann presented the three core process steps for manufacturing complex multilayer PCBs in-house:
1. Structuring: Mechanical systems such as the LPKF ProtoMat S104 or laser systems like the ProtoLaser H4 and U4 create precise conductor tracks layer by layer – supported by automatic tool change and optical fiducial mark detection.
2. Pressing: The structured layers are aligned with insulating prepregs and pressed in the hydraulic press LPKF MultiPress S4. Predefined process profiles for common materials, vacuum function, and precise temperature and pressure control guarantee reproducible results – even for demanding RF multilayers.
3. Plating: Two methods are available for the electrical connection of the layers: chemical-free plating with LPKF ProConduct (up to four layers) or classic galvanic plating with the LPKF Contac S4.
The Complete System Portfolio for the Full Workflow
For the complete workflow from simple prototypes to eight-layer multilayers prototyping, LPKF offers coordinated systems:
LPKF ProtoLaser H4 – Hybrid system for mechanical and laser processing
LPKF ProtoLaser U4 – UV laser for highest structuring precision
LPKF ProtoMat S104 – Mechanical structuring system with automatic tool change
LPKF ProtoFlow S4 – Plating system
LPKF Contac S4 – Galvanic plating
LPKF MultiPress S4 – Multilayer lamination press
All systems are mutually compatible and enable a seamless workflow from CAD design to the finished multilayer PCB.
"The demand for faster development cycles continues to rise," Guttmann explained. "With in-house multilayer manufacturing, development teams can iterate from design to tested prototype within a single day – without waiting times, without external service providers, and with complete control over sensitive design data."
Why In-house Multilayer Manufacturing?
The advantages of in-house manufacturing go far beyond pure speed:
Shortened development cycles: Multiple design iterations on the same day enable faster optimization
Confidentiality: Sensitive designs and IP remain in-house
Flexibility: Freedom to experiment and make short-notice changes without minimum quantities
Cost efficiency: No outsourcing costs for prototypes and small series
Particularly in industries with high security requirements or complex RF designs, in-house multilayer manufacturing is a decisive competitive advantage.
Did you miss the presentation at embedded world?
Here you can see a comparison of the advantages and disadvantages of the various prototyping technologies (recording of the presentation):
Do you have any questions?
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