The Power of LIDE – Enabling the Future of High-Volume Semiconductor Manufacturing with Glass Substrates
Glass is the New Core! In the race to miniaturization and higher performance, glass is becoming the substrate of choice in advanced packaging and next-gen semiconductor designs. But structuring glass at scale — without defects or yield loss — remains a challenge.
LIDE (Laser-Induced Deep Etching) changes that. It enables precise, reliable, and scalable structuring for Through Glass Vias (TGVs) and more, setting a new standard in the semiconductor industry.
Why the Future of Semiconductor Packaging is Glass – And Why LIDE Is the Key
Glass core substrates are gaining momentum in advanced IC packaging due to their thermal stability, RF performance, and dimensional accuracy. But traditional structuring methods — plasma, laser ablation, or wet etching — face major limitations in:
Microcrack formation
Slow processing speeds
Limited material compatibility
LIDE solves all of these – and more.
Key Benefits of LIDE for High-Volume Glass Structuring:
Zero Microcracks: Non-thermal structuring preserves mechanical integrity.
High Precision: Sub-micron features for advanced interconnects.
Scalable Performance: Same process, same quality – from prototype to millions of wafers.
Material Flexibility: Compatible with all major technical glasses.
Cleanroom Ready: Fully automatable and integration-ready for semiconductor fabs.
From R&D to High-Volume – Seamless Transition with LPKF
Scaling a new process from R&D to production is where many promising technologies fail. LIDE enables:
Process Continuity from lab to fab
Yield Efficiency through precision and repeatability
Support Services via our in-house Vitrion Foundry during ramp-up and scale-out
Partner Network for packaging, metrology, and integration steps
With LPKF, semiconductor manufacturers can ensure that processes are scalable without compromising quality – with the right partners at every step of the supply chain.
Beyond TGVs – LIDE’s Full Potential for Semiconductor Innovation
Glass structuring is not limited to vias. LIDE enables:
Thermal management features like embedded micro-cavities
Opto-fluidic channels for photonics and biosensors
High-precision trenchesand isolation gaps in glass IC substrates
3D microstructures for advanced packaging formats
Beyond Technology: The Role of Partnerships in Scaling Glass Structuring
Scaling advanced glass structuring technologies to high-volume manufacturing requires more than precision tools. It takes a robust ecosystem of partners, aligned processes, and deep industry expertise.
LPKF combines cutting-edge technology with a holistic understanding of the semiconductor value chain. From collaborative projects with research institutes like Fraunhofer IZM to industry initiatives for panel-level glass substrates, we ensure that LIDE integrates seamlessly across R&D and mass production.
The LPKF Advantage: Partnering for Production Excellence
With LPKF, manufacturers don’t just buy a machine — they gain a trusted partner.
Turnkey Solutions: Machines, process recipes, and support from one source
Global Network: Strategic alliances for full-stack semiconductor integration
Future-Ready Technology: LIDE is already enabling next-Generation architectures today
With LIDE technology and our Vitrion Foundry, combined with strategic collaborations across the semiconductor ecosystem, we provide a holistic approach for your journey to high volume glass manufacturing.
Are you ready to take your manufacturing to the next level? Discover how LPKF’s LIDE technology can help you stay ahead — with unmatched reliability and industrial readiness.
