More Than Just TGVs – LIDE Unlocks Unlimited Potential for Glass Structuring

LIDE goes beyond TGVs—unlocking precise, crack-free glass structuring for complex geometries in semiconductor applications, fluidics, MEMS, and photonics.

Through Glass Vias (TGVs) have transformed the way interconnects are designed for advanced packaging applications, but their potential is just the beginning. As the demand for multi-functional devices and complex glass components grows, manufacturers need solutions that go beyond basic vias. 

LIDE (Laser-Induced Deep Etching) delivers the flexibility and precision to create structures that were once thought impossible, opening new doors for innovation across multiple industries.  

 

The Limitations of Traditional Methods  

Mechanical drilling, wet etching, and other conventional techniques fall short when it comes to achieving the precision and scalability required for modern applications. Common limitations include: 

  • Restricted Design Capabilities: Intricate geometries such as micro-cavities and fluidic channels are often unachievable. 

  • Structural Instability: Traditional methods frequently introduce micro-cracks, reducing durability. 

  • Material Limitations: Many approaches are incompatible with diverse glass substrates, narrowing design possibilities. 

These barriers hinder innovation, making a versatile, scalable alternative essential. 

LIDE: Beyond Just TGVs    

LIDE transforms glass structuring by enabling a wide range of advanced designs and complex geometries: 

  • Micron-Scale Cavities: Ideal for thermal management, optical applications, and MEMS devices. 

  • Channels and Filters: Supporting innovations in fluidics and biosensors. 

  • Custom Geometries: Tailored structures for photonics, micro-optics, and other cutting-edge applications. 

By preserving the structural integrity of the glass, LIDE ensures defect-free results, even for highly intricate designs. 

Revolutionizing Glass Applications Across Industries  

LIDE’s versatility makes it the technology of choice for industries that rely on glass for its unique properties, such as: 

  • Semiconductors: Advanced packaging and interconnect solutions. 

  • Photonics: High-precision optical components and micro-lenses. 

  • Life Sciences: Microfluidic devices and biosensor platforms. 

With LIDE, manufacturers can achieve unmatched flexibility and scalability, enabling them to tackle the challenges of today while preparing for the needs of tomorrow. 

The LPKF Advantage: Expertise Beyond Technology 

What sets LPKF apart is its ability to support customers from concept to production. Our Vitrion Foundry and tailored LIDE systems ensure: 

  • End-to-End Support: Guidance through every phase of development and production. 

  • Material Versatility: Compatibility with glass from all major suppliers for maximum design freedom. 

  • Proven Scalability: From R&D prototypes to high-volume manufacturing, LIDE scales effortlessly. 

Related Articles

 

The Power of LIDE – Enabling the Future of High-Volume Semiconductor Manufacturing with Glass Substrates

 

Glass Structuring Solutions for High-Volume Manufacturing: The LIDE Advantage for Precision TGV Results

 

More than simple through-hole plating – Why reliable TGV quality is crucial for mass production


 Take your glass structuring capabilities to the next level

Contact us today to learn how LIDE can revolutionize your production processes.

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