Metallization
made easy.

Through-hole plating solutions

Fast, reliable, laboratory-compatible

The prototyping process isn’t finished after the circuit board has been manufactured. With the subsequent processes – through-hole plating, solder mask coating, solder paste printing, assembly, and reflow soldering – a circuit board becomes an electronic assembly.

 Work with no chemicals or by electroplating


Two paths to the perfect results

  • The chemical-free through-hole plating process LPKF ProConduct® metallizes through-holes with diameters of up to 0.4 mm and aspect ratios of up to 1:4. At 19 milliohms on average, the electrical resistance of the plated-through holes is extremely low.
     
  • For through-hole electroplating, the LPKF Contac S4 combines various electrolytic and chemical processes in a compact safety housing.

The perfect couple: laser structuring and through-hole electroplating

Chemical-free through-hole coating

LPKF ProConduct® is a system for chemical-free through-hole coating of double-sided and multilayer PCBs with paste. It is compact, fast, and easy to use.

Through-hole electroplating

For the wet chemical process, no knowledge of chemistry is needed; the LPKF Contac S system independently indicates the necessary process steps.

 Download brochure

Brochure chemical-free through-hole plating
LPKF ProConduct (pdf - 674 KB)
Download
Brochure galvanic through-hole plating
LPKF Contac S4 (pdf - 176 KB)
Download

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