Manufacturing high performance PCBs
- Fully automatic operation incl. automatic tool change
- Low-maintenance high-speed milling spindle
- Intuitive, integrated system software
- Camera controlled fiducial recognition and milling width control
- Granite base for highest accuracy results
The allrounder in printed circuit board processing
Suitable for almost all in-house prototyping applications
Milling Spindle 60 000 RPM
The milling spindle with 60 000 rpm guarantees shortest machining times and highest geometric accuracy. It is low-maintenance due to the new pneumatic self-cleaning function for milling spindle and milling depth sensor. The granite machine base also ensures consistently accurate results..
Automatic: Tool Change, Milling Width Adjustment, Dispensing
Up to 15 tools – more if required – can be changed automatically during the production process. Depending on the intrusion depth, the conical milling cutters generate different insulation channels. The automatic milling width adjustment ensures that the milling contour has a constant width. This shortens the set- up time and enables operator-free performance. Sensors in the ProtoMat S64 ensure optimally controlled, exact milling depth and also monitor the tool change process.
2.5 dimensional machining
Housing parts can be machined in up to 2.5 dimensions.
Solder paste dispenser
If required, the integrated dispenser can fully automatically apply solder paste to solder pads. Additional data calculation is not necessary.
Sensors in the ProtoMat S64 ensure optimally controlled, exact milling depth and also monitor the tool change process.
|Milling/drilling of single- and double-sided circuit boards||•||•||•|
|Milling/drilling of HF and microwave substrates||-||•||•|
|Milling/drilling of multilayers with up to eight layers||•||•||•|
|Contour milling of circuit boards||•||•||•|
|Laser structuring of ultrafine conductor areas||-||-||-|
|Milling of flexible and flex-rigid circuit boards||-||-||•|
|Engraving of front panels/plates||•||•||•|
|Milling of cutouts in front panels||-||•||•|
|Milling of SMD solder paste stencils||-||•||•|
|Laser cutting of SMD solder paste stencils||-||-||-|
|Structuring of ceramic materials||-||-||-|
|Machining of housings||-||•||•|
|Milling of solder frames||-||•||•|
|Depaneling and postprocessing of circuit boards||-||•||•|
|Drilling of test adapters||-||•||•|