LPKF ProtoFlow E

Compact reflow oven for SMD soldering

  •     Convection oven
  •     Lead-free reflow process
  •     Maximum temperature 320 °C
  •     Multi-zone temperature and time profiles
  •     USB port

Successful soldering in just a few minutes

Profile programming and setting of parameters becomes very easy

The LPKF ProtoFlow E is an extremely user-friendly convection oven suitable for lead-free SMD soldering of printed circuit boards up to a size of 160 x 200 mm.

Information

The intuitive menu navigation makes programming profiles and setting parameters so easy that beginners and professionals alike can successfully solder a circuit board in just a few minutes. The ergonomic design includes four navigation buttons and an LCD screen; these operating elements provide access to all oven functions.

The oven is manually operated; a large viewing aperture and an illuminated process chamber allow the operator to see the progress of the reflow process and, if necessary, make immediate corrections. The heating element and the precisely controllable air temperature ensure even heat distribution over the entire PCB surface.

As an additional option, the LPKF ProtoFlow E can be connected to a PC via a USB interface, making profiling even faster and more user-friendly.

 Downloads

Brochure
LPKF ProtoFlow E (pdf - 168 KB)
Download
Catalog
Rapid PCB Prototyping Product Catalog (pdf - 3 MB)
Download
TechGuide
LPKF TechGuide Rapid PCB Prototyping (pdf - 3 MB)
Download

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LPKF Edition SMT ProtoPlace S4 pick & place system for SMD assembly of PCB prototypes

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LPKF ProtoFlow E reflow oven

The ProtoFlow E is the entry-level model for reflow soldering.

Reflow oven LPKF Edition SMT ProtoFlow S4

Reflow oven for SMD soldering, also with lead-free, RoHS-compliant solder. The system also cures the ProConduct through-hole plating paste.

With LPKF ProMask, printed circuit boards can be quickly and easily equipped with solder resist masks. The LPKF ProLegend assembly print identifies the position of the components on the printed circuit board and can be used for any labeling. Both processes are based on manual lacquer application.

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