Press for manufacturing multilayer boards
- Presses rigid and flexible materials
- Suitable for RF materials
- Preset and individual process profiles
Press for Standard and RF Multilayers
Special process profiles ensure reliable bonding of RF materials
Individual process profiles
The process parameters can be set via a menu-supported LCD display and saved as a profile.
The system is supplied with an automatic hydraulic unit.
Systems for multilayer manufacturing
Consistent processes, proven technology
The LPKF ProtoMat S103 is the system of the LPKF ProtoMat S family with automatic tool change, vacuum table and camera for optical registration of the register marks. Automatic milling width adjustment ensures precise PCB structures with identical milling channels.
With the LPKF ProtoLaser S4, it only takes a few minutes from the layout to the structured circuit board - exact geometries on many substrates. The ProtoLaser S4 can also reliably process copper surfaces with inhomogeneities up to 6 μm and is ideally suited for the production of multilayers.
The LPKF MultiPress S scores with a short pressing time of approx. 90 minutes and sophisticated temperature management. Storable pressure and temperature profiles provide optimum support for the user.
The electrical connections between the individual layers are made by LPKF ProConduct, a chemical-free system specially developed for laboratory use. If there are more than four layers, galvanic through-hole plating is recommended.
With multilayers, the connection of layers with vias is of particular importance. The classical galvanic process is obligatory for six layers or more. The LPKF Contac S4 table system is easy and safe to operate without chemical knowledge.