SMT stencil printer for fine-pitch SMD prototyping
- SMD fine-pitch printing up to 0.4 mm
- Application of solder pastes
- Printing of double-sided printed circuit boards
- Parallel separation of stencil and PCB
When assembling printed circuit boards with tiny SMD components, the developer is dependent on an exact application of solder paste. A large number of different solder deposits can be realised safely and quickly in a single operation using stencil printing.
With the ProtoPrint S4, LPKF offers a manual stencil printer for precise printing results. The device is suitable for single-sided and double-sided printing of PCB prototypes as well as small batches. The LPKF Edition SMT ProtoPrint S4 uses stainless steel stencils. Due to an integrated clamping frame, polyimide foils can also be used. Depending on the stencil material, the appropriate squeegee material is defined.
The LPKF Edition SMT ProtoPrint S4 offers high positioning accuracy, SMD fine pitch printing, adjustable print height and easy clamping of stencil frames. The flat base plate offers enough space for magnetic PCB holders. Three micrometer screws for the X, Y and the rotation angle on the plate are used for fine positioning of the PCB.
Optimised data for a perforated polyimide foil stencil can be easily generated from the PCB layout data using the LPKF CircuitPro software. An LPKF ProtoMat conveniently mills out the stencil - the solder paste can be printed after just a few minutes.
SMT / Finishing: Products and systems at a glance
With LPKF ProMask, printed circuit boards can be quickly and easily equipped with solder resist masks. The LPKF ProLegend assembly print identifies the position of the components on the printed circuit board and can be used for any labeling. Both processes are based on manual lacquer application.