When assembling printed circuit boards with tiny SMD components, the support of an assembly system is required. With the LPKF Edition SMT ProtoPlace E4 manual pick & place system, components are safely removed from the component trays or integrated tape feeders by vacuum needle.
The ergonomically shaped placement tool is guided to the appropriate position above the PCB, the component is placed, and the vacuum is deactivated - all very easily with just one hand. An integrated camera, the monitor directly above the work surface and the smooth running of the axes support precise work.
In order to hold a wide variety of components securely, several needle diameters are required. The common needle diameters are already included in the system so that the ProtoPlace E4 can be used directly.
For component placement with the ProtoPlace E4, solder paste must be applied to the corresponding pads of the PCBs in advance. This can ideally be done with the dispensing function of an LPKF ProtoMat or via stencil printing with the LPKF ProtoPrint S4.
SMT / Finishing: Products and systems at a glance
Manual SMD fine-pitch stencil printer for precise application of solder paste to circuit boards.
Manual pick & place system for SMD assembly of PCB prototypes and small series in the laboratory.
Automatic pick & place system for SMD assembly of PCB prototypes and small series in the laboratory.
Reflow oven for SMD soldering, also with lead-free, RoHS-compliant solder. The system also cures the ProConduct through-hole plating paste.
With LPKF ProMask, printed circuit boards can be quickly and easily equipped with solder resist masks. The LPKF ProLegend assembly print identifies the position of the components on the printed circuit board and can be used for any labeling. Both processes are based on manual lacquer application.