Micro material processing in the lab
On the right track to innovation
Innovation and experience
A key advantage of the laser as a tool is the small focal spot size of the laser beam. Thus, in the extreme case, cut channels with widths of just 15 µm can be produced. This precision also applies, e.g., to corner radii and sharp cut edges – making the laser particularly interesting for HF applications.
The range of options available with LPKF ProtoLasers comprises:
- Cold ablation of various thin films with picosecond lasers.Use of ultrashort pulses opens up completely new possibilities in material processing. The pulse width is so short that virtually no thermal effects arise in the vicinity of the point of impingement on the material. The ProtoLaser R is hence suitable, e.g., for machining delicate layers for OLED lighting or complex thin-film solar cells.
- Gentle machining of laminated materials such as FR4 boards with IR lasers in the “green” range of the visible light spectrum. The ProtoLaser S is predestined for surface machining of PCB materials.
- Precise machining of ceramics. The ProtoLaser U4, which is equipped with a UV laser source, structures, e.g., metal layers on ceramic substrates (Al2O3), can score ceramics, and is outstanding for processing of LTCCs (structuring, cutting, and drilling).
LPKF ProtoLaser U4 in action
Overview of LPKF ProtoLasers
Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.
Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.
The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.