LaserMicronics Micromachining Services

LaserMicronics

Micromachining
Services
Laser Cutting of Electronic Components

LaserMicronics

Laser Cutting of
Electronic Components
Laser Plastic Welding

LaserMicronics

Laser Plastic Welding
Cutting micro-parts from metal

LaserMicronics

Cutting Micro Parts

Micromachining Services

LaserMicronics

Under the LaserMicronics brand, LPKF offers laser micromachining services. The range of services extends from feasibility studies through prototype production to series production. Specialised application engineers use the leading LPKF laser technology and ensure technically superior and high-quality products as well as cost-effective production.

The service portfolio of LaserMicronics

 Process Development - From planning to production.
Process Development

From planning to production.

Laser Plastics Welding - Non-contact laser welding processes.
Laser Plastics Welding

Non-contact laser welding process.

Laser Cutting - Precise work with the UV laser.
Laser Cutting

Precise work with the UV laser.

Drilling Microvias - Manufacture of microvia holes with diameters of less than 200 microns.
Drilling Microvias

Manufacture of microvia holes with diameters of less than 200 microns.

Microprocessing Ceramics - Cutting, drilling, scribing and engraving of ceramics.
Microprocessing Ceramics

Cutting, drilling, scribing and engraving of ceramics.

Cutting Micro Parts - High-precision cutting parts with a thickness of up to 2 mm, cut from sheets.
Cutting Micro Parts

High-precision cutting parts with a thickness of up to 2 mm, cut from sheets.

Repair & Rework - Solder resists and foils open and reduce scrap.
Repair & Rework

Solder resists and foils open and reduce scrap.

TCO / ITO Laser Processing - The finest insulation in the TCO layer invisible lasers.
TCO / ITO Laser Processing

The finest insulation in the TCO layer invisible lasers.

Solder-Resists and Foils - Laser machining of demanding solder mask in the HDI range <50 microns.
Solder-Resists and Foils

Laser machining of demanding solder mask in the HDI range <50 microns.