LPKF MicroX 5000

State of the Art Laser Cutting and Drilling of PCBs

The Solution for Laser Drilling and Cutting in the Flex- and Rigid-PCB Industry

The LPKF MicroX 5000 platform addresses the demanding requirements of the blind and through-hole via drilling. Outstanding quality processing and high performance in combination with intelligent service concepts lead to high first-pass yield and low total cost of ownership.

Greater versatility and efficiency for a wider range of materials

The LPKF MicroX 5000 platform addresses many different manufacturing processes including cutting, drilling and pocketing of flexible PCB materials as well as processing IC substrates and High Density Interconnect PCBs. The high power laser source and the new LPKF scan system lift the MicroX 5000 to a new, one-of-its-kind, outstanding performance level. This combination makes the cutting-edge equipment even more valuable to meet new and increasingly complex customer requirements. User-friendly, flexible system control makes it easy to benefit from this new unsurpassed performance.



LPKF MicroX 5000 Series (pdf - 763 KB)

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