State of the Art Laser Cutting and Drilling of PCBs
The Solution for Laser Drilling and Cutting in the Flex- and Rigid-PCB Industry
Greater versatility and efficiency for a wider range of materials
The LPKF MicroX 5000 platform addresses many different manufacturing processes including cutting, drilling and pocketing of flexible PCB materials as well as processing IC substrates and High Density Interconnect PCBs. The high power laser source and the new LPKF scan system lift the MicroX 5000 to a new, one-of-its-kind, outstanding performance level. This combination makes the cutting-edge equipment even more valuable to meet new and increasingly complex customer requirements. User-friendly, flexible system control makes it easy to benefit from this new unsurpassed performance.