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SinglePico Technology from LPKF
Ultra-short pulse (USP) lasers have gained much attention in the industry for micromachining applications in areas where traditional manufacturing methods are struggling to meet the needs for miniaturization, speed, quality or cost.
To achieve the benefits of cold ablation, which is related to the process used in USP lasers, it is imperative to recognize the integration of machine components with beam parameters for effective material processing. We process a wide variety of material types with pico-second lasers in the infrared, green, and ultraviolet wavelength regimes.
Within the ultra-short pulse regime the pulse duration plays a major role in processing efficiency. LPKF's SinglePico technology works exactly in the optimum pulse duration range for PCB material processing with pulse durations around a single picosecond instead of 10 ps or longer.