SMTconnect is the only event in Europe that brings together people and technologies from the areas of development, production, services, and applications in connection with microelectronic assemblies and systems.
Part of it, is the Future Packaging Joint Booth (hall 5, booth 434) organized by Fraunhofer IZM. Its live production line provides a unique glimpse of the manufacturing process and the technologies that make it possible. Visitors get to judge the performance of the machines for themselves by seeing them in operation in an environment that mimics actual manufacturing conditions. LPKF participates in the production line and presents the new laser depaneling system LPKF CuttingMaster 3000 Ci.
LPKF will also present the new laser depaneling system LPKF CuttingMaster 2000 P at the booth of our partner SmartRep (hall 4A, booth 225/230).
Exhibitor: LPKF Laser & Electronics AG