iTGV 2026

Wuxi, China

We are looking forward to seeing you!

The iTGV (International Through Glass Via Technology Innovation and Application Forum) is the leading international forum for glass substrate technologies and TGV innovations, organized in collaboration with IEEE EPS. The event brings together experts in chip design, advanced glass substrate packaging, and core material technologies—with a focus on the technological path to mass production of glass substrates.

We look forward to seeing you at our booth!

May 28–29, 2026
Wuxi International Convention Center, Wuxi, China

For more information, click here.