ICEP 2026

Hiroshima, Japan

We are looking forward to seeing you!

ICEP-HBS2026 is one of the world's leading conferences for electronics packaging. The focus is on advanced bonding technologies, the future of semiconductor packaging, and the exchange between experts from industry, academia, and research. With more than 280 oral and poster presentations, the conference offers the most comprehensive program in ICEP history. We look forward to seeing you there!

April 14–18, 2026
International Conference Center Hiroshima, Japan

More information can be found here.