LIDE Production System for the Semiconductor Industry

Available wafer formats: 100 mm/150 mm, 200 mm/300 mm

The Vitrion S 5000 system is the production system solution for today's and future packaging and semiconductor applications with the LIDE process. The high-performance laser system processes glass wafers with unparalleled precision and speed and without causing any defects in the glass: Perfect quality for the production of through glass vias, for embedding solutions, capping wafers and advanced packaging solutions.

Key specifications at a glance

Glass wafer thickness: 0.3 to 3 mm
Bridge tool: 150/200 mm wafer or 200/300 mm wafer
EFEM: Two standard FOUPs
Compatible with flat/notch wafers
SECS/GEM for simple integration and configuration
SEMI E84
System dimensions (WxHxD): 1800 x 2200 x 3000 mm

LIDE team of experts

Customers can rely on the LIDE expert and support team to accelerate the development of new solutions and shorten time-to-market.

Under the Vitrion brand, a full-service provider is available for all aspects of LPKF's LIDE technology. The team has an eye on the market dynamics and supports you in every phase of your LIDE-based innovation. For more information on LIDE technology and application examples, please visit www.vitrion.com.

Please feel free to contact us at any time. We look forward to your questions.

More about the LIDE technology (www.vitrion.com)