Streamline Your
PCB Development Process

Corona Information

We are there for you!
Our business activities are
continuing.
Next Generation Thin-film
Scribing
Solutions for
Efficient Laser Plastic Welding
Solutions for
Advanced IC Packaging

Precision Manufacturing Solutions

Partnering with tech innovators

As a leading provider of laser manufacturing solutions, LPKF Laser & Electronics helps to create more powerful electronic systems and increase functionality and efficiency for a broad range of applications and industries.
LPKF Investor Relations
Investor Relations

All key figures & information for shareholders.

Jobs & Careers

Discover our wide range of career opportunities and become part of the LPKF team.

Services & Support

LPKF offers worldwide premium customer support.

The New Standard for Small Apertures

Based on the proven LPKF StencilLaser G 6080 system concept, the LPKF MicroCut 6080 offers unique advantages to users for whom extremely small stencil openings and the corresponding printing results are important.

With state-of-the-art positioning and cutting technology tailored to the requirements of small openings, extremely small, precise holes can be cut. With a size of just 18 μm on the laser entry side and 10 μm on the exit side (in 30-μm-thick stainless steel foil), they form the basis for overcoming process limitations and catering to rising market demands. High precision and high throughput round out these advantages.  
The simple programming and extensive software functions such as the parameter search help get the process started quickly. Applications include wafer stencils, flux stencils, and filter applications.

Press release
The New Standard for Small Apertures (pdf - 165 KB)
Download
Photo
Stencil Wafer, produced with LPKF MicroCut 6080 (jpg - 2 MB)
Download

News & Press

The New Standard for Small Apertures

Based on the proven LPKF StencilLaser G 6080 system concept, the LPKF MicroCut 6080 offers unique advantages to users for whom extremely small stencil openings and the corresponding printing results are important.

With state-of-the-art positioning and cutting technology tailored to the requirements of small openings, extremely small, precise holes can be cut. With a size of just 18 μm on the laser entry side and 10 μm on the exit side (in 30-μm-thick stainless steel foil), they form the basis for overcoming process limitations and catering to rising market demands. High precision and high throughput round out these advantages.  
The simple programming and extensive software functions such as the parameter search help get the process started quickly. Applications include wafer stencils, flux stencils, and filter applications.

Press release
The New Standard for Small Apertures (pdf - 165 KB)
Download
Photo
Stencil Wafer, produced with LPKF MicroCut 6080 (jpg - 2 MB)
Download

The New Standard for Small Apertures

Based on the proven LPKF StencilLaser G 6080 system concept, the LPKF MicroCut 6080 offers unique advantages to users for whom extremely small stencil openings and the corresponding printing results are important.

With state-of-the-art positioning and cutting technology tailored to the requirements of small openings, extremely small, precise holes can be cut. With a size of just 18 μm on the laser entry side and 10 μm on the exit side (in 30-μm-thick stainless steel foil), they form the basis for overcoming process limitations and catering to rising market demands. High precision and high throughput round out these advantages.  
The simple programming and extensive software functions such as the parameter search help get the process started quickly. Applications include wafer stencils, flux stencils, and filter applications.

Press release
The New Standard for Small Apertures (pdf - 165 KB)
Download
Photo
Stencil Wafer, produced with LPKF MicroCut 6080 (jpg - 2 MB)
Download
Productfinder
Productfinder