More than simple through-hole plating – Why reliable TGV quality is crucial for mass production
Because the semiconductor industry is very capital-intensive, reliability of any results is most important for every investment. The transition from prototyping to high-volume manufacturing (HVM) is one of the crucial challenges in the semiconductor industry. While many technologies claim to deliver reliable TGVs on an R&D level, few meet the exact standards required for HVM.
With its flawless precision and proven reliability, LPKF's LIDE process redefines what glass substrate manufacturers can expect from through glass via technology.
High-Volume Manufacturing Needs More Than Good Enough
Conventional TGV fabrication methods often present hidden risks that jeopardize HVM success:
Micro-Cracks: Structural imperfections frequently result in lower yields. Even higher when the production turns into HVM.
Process Inefficiency: Many methods struggle to balance precision with throughput, leading to bottlenecks.
Material Constraints: Limited compatibility with diverse glass types reduces design flexibility.
For cutting-edge industries like AI, automotive sensors, and advanced packaging, these issues are painful bottlenecks or simply unacceptable.
Why LIDE Sets the New Standard
LPKF’s LIDE process eliminates these common pitfalls, delivering unmatched quality for TGVs at scale:
No Micro-Cracks or Stress: The process preserves the integrity of the glass, ensuring long-term reliability even in extreme conditions.
Unparalleled Dimensional Accuracy: Each via is consistent in size and shape, enabling high electrical performance and efficient assembly.
Scalability Without Sacrifices: Whether producing hundreds or millions of glass wafer, LIDE ensures every component meets exacting standards.
Proven Technology, Ready Today
LIDE is not an experimental process — it’s already proven and deployed in companies manufacturing for semiconductor industry worldwide. Manufacturers can immediately benefit from its superior quality, scalability, and versatility.
The LPKF Advantage: Beyond the Process
Choosing the right TGV fabrication method is critical but so is having the right partner. With LPKF, you gain:
Holistic Support: From the first prototype to full-scale production, LPKF supports every phase of the journey.
End-to-End Solutions: Our in-house Vitrion Foundry offers direct access to world-class glass structuring and process development services as well as for transition phases during production growth.
Seamless Integration: Our equipment, optimized for both R&D and HVM, ensures an effortless transition between stages.
Partnering for Production Excellence
Scaling a process from R&D to HVM requires more than technology — it demands expertise and support across the whole supply chain. This is where LPKF’s Partner network comes in. For seamless integration, we work together with leading technology companies to make sure high-volume manufacturing of glass substrates, wafer and many more can be produced without any incompatibilities.
Built for High-Volume Success
Manufacturers striving for HVM success need technologies that are as reliable as they are innovative. LIDE isn’t just a tool for structuring TGVs — it’s a solution built to meet the uncompromising demands of high-volume production of glass substrates.
Ready to Scale Your Manufacturing?
Partner with LPKF to ensure your transition to high-volume production is seamless and successful. With the proven reliability of LIDE and our industry expertise, you’re not just scaling your manufacturing — you’re building the future with Tomorrow’s Technology Today.
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Contact us today to learn how LIDE can revolutionize your production processes.
