Glass Structuring Solutions for High-Volume Manufacturing: The LIDE Advantage for Precision TGV Results
The demand for scalable, precision-driven technologies in high-volume semiconductor manufacturing (HVM) is accelerating. As the shift from organic substrates to glass core substrates accelerates, the challenges of producing Through Glass Vias (TGVs) at scale have become a defining factor for success.
Glass has emerged as the material of choice, offering mechanical stability, electrical insulation, and thermal consistency, all essential for modern electronics. However, traditional methods like mechanical drilling and chemical etching often fall short, leading to cracks, structural instability, and limited scalability.
This is where LIDE (Laser Induced Deep Etching), pioneered by LPKF, transforms the landscape. Combining high precision, unmatched scalability, and proven reliability, LIDE enables defect-free glass structuring for advanced packaging applications.
Challenges in TGV Production
Scaling TGV production for HVM presents manufacturers with critical challenges:
Precision Requirements: Sub-100 µm via diameters demand exact control over geometries and tolerances.
Defect Elimination: Micro-cracks and substrate damage compromise quality and yield.
Operational Scalability: Traditional methods struggle to transition efficiently from R&D to mass production.
These roadblocks often result in yield loss, higher costs, and production inefficiencies.
LIDE: Scalable, Defect-Free Glass Structuring for TGVs
LPKF’s LIDE process overcomes these challenges with groundbreaking capabilities:
Defect-Free Precision: LIDE ensures micro-crack-free processing, even with ultra-thin glass substrates ranging from 50 µm to 1 mm.
Material Versatility: Unlike other processes, LIDE supports glass from any major supplier, enabling flexibility in design and sourcing.
Industrial Scalability: With systems like the Vitrion S5000, LIDE is tailored for 24/7 high-volume production, optimized for cleanroom environments.
More Than Just TGVs: Beyond through-glass vias, LIDE empowers the creation of cavities, filters, and complex geometries, unlocking new possibilities for next-generation devices.
Proven Performance Backed by Expertise
LIDE is not just a technology—it’s a proven solution already implemented in industrial production lines worldwide. What truly sets LPKF apart is the support provided throughout every stage of manufacturing:
Vitrion Foundry: Operational and advisory support ensures a seamless transition from R&D to HVM.
End-to-End Solutions: LPKF offers a comprehensive portfolio of systems for both prototyping and mass production.
Process Stability: Long-term testing demonstrates LIDE’s reliability and repeatability, even under the most demanding conditions.
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