Products > SMT Stencil Technology > MicroCut F
Laser System for Cutting Stencils

LPKF MicroCut F

Laser System for Cutting Stencils with Highest Packing Density (High-Density Stencils)

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The LPKF MicroCut F is a high-performance stencil laser. The LPKF MicroCut F is capable of cutting any shape at up to 50,000 openings per hour. The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.

As a result of the new cutting technology post-treatment is not necessary anymore. Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.


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LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90
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