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Laser-Cutting of SMT StencilsCutting of SMT StencilsCutting of High-Density StencilsSMT Solder Paste Stencil Cutting

SMT Stencil Technology

Laser Cutting Machines

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LPKF StencilLaser P 6060
Lowest investment cost for laser cutting of SMT stencils.

LPKF StencilLaser G 6080
High-speed laser system with ultra-light carbon-fiber-based axis construction for cutting of SMT stencils.

LPKF StencilLaser 600 HS
Laser system with open machine design for the production of high-class solder paste stencils.

LPKF MicroCut F
Laser system for cutting HD stencils with highest packing density.

LPKF MultiCut
Open machine design for cutting solder paste stencils with high efficiency.

LPKF ScanCheck MicroView
Inspection system for waferbump and precision stencils with highest packing density (HD stencils).
LPKF ScanCheck I+
Inspection System which compares solder paste stencils with the CAM data.

LPKF StencilCheck
Software for quality check of SMT stencils.

Options
Options for extending all LPKF StencilLasers.

Consumables
Top quality stainless steel for stencil production.

Software
Software to control laser machines as well as processing and checking all production data.

References
Extract from LPKF customers reference list.

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