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LPKF MicroCut

Capable of cutting any shape without burrs

LPKF MicroCut
 
The LPKF MicroCut is a high-performance stencil laser. The LPKF MicroCut is capable of cutting any shape at up to 50,000 openings per hour.

The laser can cut apertures as small as 30 µm with a roundness better than 96%, and its effective material focus diameter produces sharp contours.

As a result of the new cutting technology post-treatment is not necessary anymore.

Absolute flatness of the material is reached also with highest component density by the new LPKF PulsShape function.
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Article: Technology for wafer-level packaging and flip chip applications  (739 KB)

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LPKF Laser & Electronics AG      Osteriede 7      D-30827 Garbsen      Germany      Tel.: +49-(0)5131-7095-0      Fax: +49-(0)5131-7095-90