LPKF ProConduct® Working Process

LPKF ProConduct® uses a specially-developed conductive polymer paste to quickly and easily plate vias in as little as three minutes. These are the simple processing steps:

1. Mill the board, apply film and drill the holes

Mill the board layout using a LPKF ProtoMat plotter, then apply adhesive film to the entire board surface and drill the holes.

2. Apply the LPKF ProConduct® Paste

Secure the board to the vacuum table and apply LPKF ProConduct® Paste to the adhesive film with the squeegee provided. The vacuum process draws the conductive paste through the holes. The board can be flipped and paste can be applied to the opposite side to ensure that the holes are completely coated.

3. Cure the paste

Remove the film after the LPKF ProConduct® Paste is applied, then insert the board into a hot-air oven for 30 minutes to cure the paste. After the board has cooled for a few minutes it can be populated with components and tested.