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LPKF ProConduct® Technical Data
| Max. base material | 229 mm x 305 mm (9" x 12") |
| Min. hole diameter | 0.4 mm (15 mil) up to aspect ratio of 4:1* |
| Number of through-plated holes per circuit board | no limit |
| Number of layers | 4 |
| Solderability | Reflow soldering < 220° C (428° F) |
| Base material types | FR4, FR3, RF and microwave materials incl. PTFE based materials |
| Process duration | 35 min |
| Resistance (hole diameter 0.4-1.0 mm at 1.6 mm (63 mil) material thickness) |
average 19.2 mOhm with standard deviation of 7.7 mOhm |
| Product information |
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| Circuit Board Plotter Accessories Consumables Multilayer |
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