The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is extremely fast and easy to use. Its rapid parallel processing method delivers completely safe, reliable and thermally stable via plating results for double-sided or multilayer boards.
Circuit board prototypes can be easily fabricated in-house in a single day when the LPKF ProConduct® system is combined with an LPKF ProtoMat circuit board plotter.
In-house PCB prototyping gets your designs to market faster by eliminating production delays and high costs that can occur with outside vendors. It also makes your precious design data secure by keeping it under your control.
LPKF ProConduct® uses specially-developed plating technology to rapidly plate vias as small as 0.4 mm (15 mil) up to aspect ratio of 1:4. Even smaller holes are possible under special conditions. The entire process can be completed in just a few minutes for double-sided and even multilayer boards. The electrical resistance of LPKF ProConduct® plating is extremely low with 19.2 mOhm depending on the material thickness. For more information please read the technical data.
See Multilayer for information about using through-hole plating systems to produce multilayer circuit boards.
Secure the board to the vacuum table and apply LPKF ProConduct® Paste to the adhesive film with the squeegee provided. The vacuum process draws the conductive paste through the holes. The board can be flipped and paste can be applied to the opposite side to ensure that the holes are completely coated.
Remove the film after the LPKF ProConduct® Paste is applied, then insert the board into a hot-air oven for 30 minutes to cure the paste. After the board has cooled for a few minutes it can be populated with components and tested.