Products > Rapid PCB Prototyping > Through-Hole Plating > Chemical-free > ProConduct
You are here: Products > Rapid PCB Prototyping > Through-Hole Plating > Chemical-free > ProConduct
 
Chemical-free Through-Hole Plating

LPKF ProConduct®

In-House PCB Through-Hole Plating without Chemicals

General
The LPKF ProConduct® introduces revolutionary technology to produce plated through-holes, which does not require a plating tank or potentially hazardous processing chemicals. This compact system is extremely fast and easy to use. Its rapid parallel processing method delivers completely safe, reliable and thermally stable via plating results for double-sided or multilayer boards.

Preview Movie


Circuit board prototypes can be easily fabricated in-house in a single day when the LPKF ProConduct® system is combined with an LPKF ProtoMat circuit board plotter.

In-house PCB prototyping gets your designs to market faster by eliminating production delays and high costs that can occur with outside vendors. It also makes your precious design data secure by keeping it under your control.

LPKF ProConduct® uses specially-developed plating technology to rapidly plate vias as small as 0.4 mm (15 mil) up to aspect ratio of 1:4. Even smaller holes are possible under special conditions. The entire process can be completed in just a few minutes for double-sided and even multilayer boards. The electrical resistance of LPKF ProConduct® plating is extremely low with 19.2 mOhm depending on the material thickness. For more information please read the technical data.

See Multilayer for information about using through-hole plating systems to produce multilayer circuit boards.

Technical data
Max. base material 229 mm x 305 mm (9" x 12")
Min. hole diameter 0.4 mm (15 mil) up to an aspect ratio of 1:4 *
Number of plated holes No limit
Number of layers 4
Solderability Reflow soldering 250° C (482° F),
manual soldering 380° C (716° F) **
Base material types FR4, RF- and microwave materials
(incl. PTFE-based materials)
Processing time Approx. 35 min
Electric resistance
(Hole diameter 0.4 - 1.0 mm at 1.6 mm /
63 mil material thickness)
Average 19.2 mOhm with
standard deviation of 7.7 mOhm

    * Smaller hole diameters upon request
    ** Soldering agent recommendation upon request

Working Process
LPKF ProConduct® uses a specially-developed conductive polymer paste to quickly and easily plate vias in as little as three minutes. These are the simple processing steps:

1. Mill the board, apply film and drill the holes

Mill the board layout using a LPKF ProtoMat plotter, then apply adhesive film to the entire board surface and drill the holes.

Preview Movie



2. Apply the LPKF ProConduct® Paste

Secure the board to the vacuum table and apply LPKF ProConduct® Paste to the adhesive film with the squeegee provided. The vacuum process draws the conductive paste through the holes. The board can be flipped and paste can be applied to the opposite side to ensure that the holes are completely coated.

Preview Movie



3. Cure the paste

Remove the film after the LPKF ProConduct® Paste is applied, then insert the board into a hot-air oven for 30 minutes to cure the paste. After the board has cooled for a few minutes it can be populated with components and tested.

Preview Movie


Accessories

Vacuum Table
Desktop vacuum table: The vacuum process draws the conductive paste through the PCB holes.
Hot Air Oven
Hot-air oven: insert the board into the hot-air oven for 30 minutes to cure the paste..

Brochures

Rapid Prototyping Product Catalog


View online
PDF download
Order now

                                       
LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
© by LPKF

 
LPKF Group Sites
LPKF LaserWelding
LPKF SolarQuipment
LaserMicronics
ZelFlex Stretching Frames

LPKF Distributors
Europe (West)
Austria   
Belgium   
France   
Luxembourg   
Netherlands   
Switzerland   
Europe (East)
Czech Republic   
Hungary   
Poland   
Romania   
Russia   
Slovenia   
Ukraine   
Europe (North)
Danmark   
Estonia   
Finnland   
Ireland   
Latvia   
Lithuania   
Norway   
Sweden   
UK   
Europe (South)
Bosnia and Herzegovina   
Croatia   
Greece   
Italy   
Portugal   
Macedonia   
Montenegro   
Serbia   
Spain   
Turkey   
America
Argentina   
Brazil   
Canada   
Chile   
Colombia   
Mexico   
Peru   
USA   
Venezuela   
Asia
China   
Hong Kong   
India   
Indonesia   
Iran   
Israel   
Japan   
Jordan   
Korea   
Malaysia   
Pakistan   
Philippines   
Saudi Arabia   
Singapore   
Taiwan   
Vietnam   
Africa
Algeria   
Egypt   
Kenya   
Morocco   
Nigeria   
South Africa   
Tunesia   
Australia