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LPKF ProMask and LPKF ProLegend Technical Data

Max. base material dimensions 229 mm x 305 mm (9" x 12")
Max. working area of image exposer 240 mm x 340 mm (9,5" x 13")
Base material types FR4, FR3, RO3000®, RO4000®, TMM® *
Processing time Approx. 60 min
PAD separation ≥0.5 mm (20 mil) fine pitch
Adhesion strengtht Class H and T, testing method: IPC-SM-840 C, Subsection 3.5.2.1
Solder bath resistance 20 sec at 265 °C (509 °F), testing method: IPC-SM-840 C, Subsection 3.7.2
10 sec at 288 °C (550 °F), testing method: MIL-P 55 110 D
20 sec at 288 °C (550 °F), testing method: UL 94 (lead-free)
Surface resistance 20 kOhm, testing method: VDE 0303, Section 30, DIN IEC 93
Moisture resistance an isulation resistance Class H and T, testing method: IPC-SM-840 C, Subsection 3.9.1
Solvent/Cleaning agent stability IPC-SM-840 C (10% caustic cleaner, isopropyl alcohol, monoethanolamine)
Minimum capital height 2.0 mm (with 1,200 dpi laser printer)
Minimum capital strength 0.1 mm (with 1,200 dpi laser printer)
Hardware requirements 600 (or higher) dpi laser printer
Software requirements CircuitCAM 5.1 or higher

* Further materials upon request.
Specifications subject to change.
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Further products
Circuit Board Plotter
Accessories
Consumables
Multilayer


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