| Max. base material dimensions | 229 mm x 305 mm (9" x 12") |
| Max. working area of image exposer | 240 mm x 340 mm (9,5" x 13") |
| Base material types | FR4, FR3, RO3000®, RO4000®, TMM® * |
| Processing time | Approx. 60 min |
| PAD separation | ≥0.5 mm (20 mil) fine pitch |
| Adhesion strengtht | Class H and T, testing method: IPC-SM-840 C, Subsection 3.5.2.1 |
| Solder bath resistance | 20 sec at 265 °C (509 °F), testing method: IPC-SM-840 C, Subsection 3.7.2 10 sec at 288 °C (550 °F), testing method: MIL-P 55 110 D 20 sec at 288 °C (550 °F), testing method: UL 94 (lead-free) |
| Surface resistance | 20 kOhm, testing method: VDE 0303, Section 30, DIN IEC 93 |
| Moisture resistance an isulation resistance | Class H and T, testing method: IPC-SM-840 C, Subsection 3.9.1 |
| Solvent/Cleaning agent stability | IPC-SM-840 C (10% caustic cleaner, isopropyl alcohol, monoethanolamine) |
| Minimum capital height | 2.0 mm (with 1,200 dpi laser printer) |
| Minimum capital strength | 0.1 mm (with 1,200 dpi laser printer) |
| Hardware requirements | 600 (or higher) dpi laser printer |
| Software requirements | CircuitCAM 5.1 or higher |
| Product information |
| Circuit Board Plotter Accessories Consumables Multilayer |

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