LPKF ProMask and LPKF ProLegend Working Process

Apply the solder resist mask or board finish in four simple steps

ProLegend’s process is almost identical. Please contact a sales representative for more information.

1. Producing the artwork

The artwork template is easily produced by printing it from LPKF CircuitCAM (version 5.0 or above) on a standard laser printer (for best results 600 or 1200 dpi).

2. Applying the lacquer

The lacquer is simply mixed using the single portion sachets of lacquer and hardener. It is then applied to the finished prototype PCB using a disposable roller. After application the PCB is pre-dried for 10 minutes in the hot-air oven.

3. Exposing PCB with the artwork

The PCB is placed in the image exposure unit and the artwork is placed over it using registration marks. The exposure unit is switched on for 30 seconds after which the board is removed and the artwork film pulled off.

4. Developing and hardening the solder-resist mask

A bath of developer is prepared from the developer powder and hot water. The PCB is immersed in the bath and the non exposed resist is removed by gently brushing. The lacquer residue is rinsed off under flowing water, then the resist is hardened for 30 minutes in the hot-air oven after which the board can be cleaned with LPKF cleaner and rinsed with water.