Products > Rapid PCB Prototyping > Solder Masks / Legend Printing > ProMask and ProLegend
| Max. material size | 229 mm x 305 mm (9'' x 12'') |
| Max. layout area of image exposer | 240 mm x 340 mm (9,5'' x 13'') |
| Processing time | Approx. 60 min/ cycle |
| Pad separation | ≥0.5 mm (20 mil) fine pitch |
| Adhesion strengtht | Class H and T, testing method: IPC-SM-840 C, Subsection 3.5.2.1 |
| Solder bath resistance | 20 sec at 265 °C (509 °F), testing method: IPC-SM-840 C, Subsection 3.7.2 10 sec at 288 °C (550 °F), testing method: MIL-P 55 110 D 20 sec at 288 °C (550 °F), testing method: UL 94 (lead-free) |
| Surface resistance | 2 x 10 exp 14 Ohm, test method: VDE 0303, Part 30, DIN IEC 93 |
| Moisture resistance an isulation resistance | Class H and T, test method: IPC-SM-840 C, item 3.9.1 |
| Solving/ cleaning agent resistance | IPC-SM-840 C, item 3.9.1 (10 percent alkaline cleaner, Isopropanol, monoethanolamine) |
| Minimum capital height | 2.0 mm (with 1.200 dpi laser printer) |
| Minimum capital strength | 0.1 mm (with 1.200 dpi laser printer) |
| Hardware requirements | Min. 600 dpi laser printer |
| Software requirements | CircuitCAM 5.1 or higher |