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LPKF ProtoPlate LDS

LPKF ProtoPlate LDS

Metallizing 3D-Molded Interconnect Devices

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Description
With ProtoPlate, LPKF closes a gap in prototyping three-dimensional molded interconnect devices. With laser direct structuring, a laser beam applies strip conductor structures onto a three-dimensional plastic component. Copper and other metal layers are then deposited on these structures in a currentless metallization process.

Creating Strip Conductors in a Beaker

The new ProtoPlate reduces the processing effort required for metallization considerably. Metallization of three- dimensional interconnect devices can now be carried out in your own laboratory without any appreciable chemical knowledge. The LPKF ProtoPlate basic package consists of an integrated processing cell with beaker, magnetic stirrer, temperature monitor and internal air filtering. The chemical consumables for the copper build-up are summarized in the LPKF ProtoPlate CU set.

As Easy as Making Coffee

Metallization is very easy: The clean structured components are immersed in the bath and metallization begins after a few minutes. Depending on the duration of the metallization process, uniform copper layers develop with a thickness of 3 μm to 10 μm on the plastic component. Finally, the LDS components are removed and rinsed.

Video

Prototype 3D-Circuits in Your Own Lab


Technical Data
LPKF ProtoPlate LDS
Enclosure size (W x H x D) 413 mm x 706 mm x 479 mm
Weight 23 kg
Power supply 230 V AC, 50 Hz / 110 V AC, 60 Hz
Power input 600 VA
Ambient temperature 20 °C bis 24 °C (room temperature)
Chemical set CU*
Shelf life or storage of chemicals Can be stored unopened for one year
Storage temperature of chemicals 5° C to 25° C, dry


* For further details, see chemical safety data sheets and user manual

Brochure LPKF ProtoPlate
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Rapid PCB Prototyping Product Catalog

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LPKF TechGuide PCB Prototyping

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