Laser Ablation with Virtually No Heat InputIn laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately.
Proven HousingThe new ProtoLaser R is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.
Micro-Material Processing SpecialistUnlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.
Established System SoftwareThe LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster.
- Picosecond laser for the research lab
- Cold ablation of different thin-film-layers
- Intuitive CAM software
- Field-proven housing concept
|LPKF ProtoLaser R|
|Max. material size and layout area
(X x Y x Z)
|229 x 305 x 10 mm
( 9” x 12 “ x 0.4” )
|Laser wavelength||1 030 nm|
|Laser pulse frequency||Max. 200 kHz|
|Laser pulse duration||1 ps|
|Laser power||Max. 4 W|
|Laser spot diameter in focus position||15 μm (0.6 mil)|
|Table move speed (X x Y x Z)||100 x 100 x 10 mm/s
(4”/s x 4”/s x 0.4”/s)
|Dimensions (W x H x D)||875 x 1 430 x 820 mm
(34.5” x 56.3” x 32.3”)
|Electrical consumption||110 V - 230 V; 1.5 kW|
|Required accessories||Exhaust unit, PC, compressor (optional)|
Brochure LPKF ProtoLaser R