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LPKF ProtoLaser U3

Micromaterial Processing with Laser Technology

Description

Minimal Requirements, High Performance

The LPKF ProtoLaser U3 requires only an electrical connection, dust extraction and compressed air - and then things can take off. It will go through any laboratory door and can be easily moved on its rollers.

Broad Range of Materials

Ceramic, LTCC (green tape), FR4, Rogers, protective sheets and metal foils or flexible and flex-rigid materials: the LPKF ProtoLaser U3 can process the most varied materials quickly, cleanly and precisely.

Advantages of Laser Processing

The LPKF ProtoLaser U3 opens up a host of new options for product development. If you are doing your own prototyping, it can process unusual materials, deal with a complex substrate structure and is ideal for multi-layer production.

The laser process itself stands out from competing processes due to its high flexibility and fast processing. The laser uses no environmentally hazardous chemicals, requires no masks and keeps outlay for tool production to a minimum. The laser works contact-free and therefore can also be used with sensitive materials.

The ProtoLaser U3 can make prototypes of a quality that meets or even exceeds that of industrial processing. It is also suitable for small series production and for production of individual components with high variance.

Pictures
ProtoLaser U3 Handling
The ProtoLaser U3 cuts a multitude of materials.
ProtoLaser U3 Processing Unit
The optimal focal position of the laser is set automatically.
ProtoLaser U3 System
The ProtoLaser U3 combines the processing options of its predecessor, the ProtoLaser U, with those of the ProtoLaser S, which is still available.

Video Technical Data
Technical Specifications: LPKF ProtoLaser U3
Max. material size and layout area (X/Y/Z) 229 mm x 305 mm x 7 mm (9” x 12” x 0.27”)
Laser wavelength 355 nm
Diameter of focussed laser beam 15 μm (0.6 mil)
Resolution scanfield 2 μm (0.08 mil)
Repeatability ± 2 μm (± 0.08 mil)a
Dimensions (W x H x D) 875 mm x 1,430 mm x 750 mmb (34.5” x 56.3” x 29.5”)b
Weight 300 kg (661 pounds)
Operating conditions
Power supply
110/230 V, 50 - 60 Hz, 1.4 kW
Compressed air supply**
8 bar (116 psi), 160 l/min (5.66 cfm)
Cooling
Air cooled (internal cooling cycle)
Ambient temperature
22 °C ± 2 °C (68 °F ± 4 °F)
Required accessories Exhaust, standard PC
Hardware and software requirements Microsoft Windows XP or 7, 1 GHz processor or higher, min. 1 GB RAM, min. screen resolution 1024 x 768 pixels, USB 2.0

a This value reflects direct repeated movements of the laser beam
b Height with open working door 1,730 mm (68.1”)
* Required only when working with laminated materials

Technical specifications subject to change.

Brochure

More information



                                       
LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
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