LPKF ProtoLaser U3

Micromaterial Processing with
Laser Technology

Minimal Requirements, High Performance

The LPKF ProtoLaser U3 requires only an electrical connection, dust extraction and compressed air - and then things can take off. It will go through any laboratory door and can be easily moved on its rollers.

Broad Range of Materials

Ceramic, LTCC (green tape), FR4, Rogers, protective sheets and metal foils or flexible and flex-rigid materials: the LPKF ProtoLaser U3 can process the most varied materials quickly, cleanly and precisely.

Advantages of Laser Processing

The LPKF ProtoLaser U3 opens up a host of new options for product development. If you are doing your own prototyping, it can process unusual materials, deal with a complex substrate structure and is ideal for multi-layer production.

The laser process itself stands out from competing processes due to its high flexibility and fast processing. The laser uses no environmentally hazardous chemicals, requires no masks and keeps outlay for tool production to a minimum. The laser works contact-free and therefore can also be used with sensitive materials.

The ProtoLaser U3 can make prototypes of a quality that meets or even exceeds that of industrial processing. It is also suitable for small series production and for production of individual components with high variance.

Pictures

The ProtoLaser U3 cuts a multitude of materials.

The optimal focal position of the laser is set automatically.

The ProtoLaser U3 combines the processing options of its predecessor, the ProtoLaser U, with those of the ProtoLaser S, which is still available.

Technical Data

Technical Specifications: LPKF ProtoLaser U3
Max. material size and layout area (X/Y/Z)	229 mm x 305 mm x 10 mm (9” x 12” x 0.4”)
Laser wavelength	355 nm
Diameter of focussed laser beam	15 μm (0.6 mil)
Accuracy*	2 μm (0.08 mil)
Repeatability	± 2 μm (± 0.08 mil)^a
Dimensions (W x H x D)	875 mm x 1,430 mm x 750 mm^b (34.5” x 56.3” x 29.5”)^b
Weight	260 kg (573 pounds)

Operating conditions
Power supply	110/230 V, 50 - 60 Hz, 1.4 kW
Compressed air supply**	8 bar (116 psi), 160 l/min (5.66 cfm)
Cooling	Air cooled (internal cooling cycle)
Ambient temperature	22 °C ± 2 °C (68 °F ± 4 °F)
Required accessories	Exhaust, standard PC
Hardware and software requirements	Microsoft Windows 2000 or higher, 700 MHz or faster processor, min. 512 MB RAM (1 GB recommended), min. screen resolution 1024 x 768 pixels, USB 2.0

_{a This value reflects direct repeated movements of the laser beam
b Height with open working door 1,730 mm (68.1”)
* Resolution scanfield
** Required only when working with laminated materials}

Brochures

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