LPKF ProtoLaser U

Micromaterial processing with laser technology

The LPKF ProtoLaser U is able to process almost all types of material in mini series and prototype production: ceramics, LTCC (Greentape), FR4, protective films and
metal foils, or flex and rigid-flex materials.

The laser system can precisely depanel separate PCBs from a large panel array (assembled or
unassembled), cuts LTCC and prepreg, structures TCO/ ITO and etching resists or  opens up solder resists and protective films. The LPKF ProtoLaser U can drill holes or microvias with a minimum diameter of only 50 μm in HDI boards.

The focused and regulated UV laser beam produces quick, clean and precise results. Tooling costs are a thing of the past. The ProtoLaser U operates using a non-contact process. Its affordable price and simple operating makes it the ideal tool for research and development.

LPKF CircuitCAM software quickly and simply converts all standard layout data formats into production data. For numerous applications process parameters are already loaded. Administrator mode gives full control of all the system settings. The laser switches off automatically when the machine hood is opened; preventing any accidents that could occur. The system has the highest possible laser safety rating of Class 1 while operating.