The LPKF ProtoMat H100 system provides significant reductions in the production time of prototype PCBs. The maximum milling speed is now almost doubled compared to the previous top-of-the-line system and can reach up to 100mm (4 inches) per second. The integrated smart following vector path generation allows the system to maintain a higher average speed. The combination of both of these features pushes the performance factor to 2-3 times.
Now, production of prototype multilayer boards can be comfortably accomplished in-house. The resolution has been increased five-fold to 1 µm. Utilizing the 100,000 rpm spindle motor, the plotter creates 100µm (4 mil) tracks and spacing. This accommodates all state-of-the-art packages, including BGA and µBGA®.

No options are necessary. The ProtoMat H100 is fully equipped. The dust extraction unit can be placed behind the acoustic cabinet.
Along with increased performance and a 30-position automatic tool changer, the LPKF ProtoMat H100 also includes new features derived from high-volume production systems. Until now, these features have been unknown in this class of prototyping equipment.
Automatic tool calibrationNew tools are automatically calibrated to ensure optimum milling results. A sensor located in the plotter table top automatically sets the milling tool depth, and the software-controlled adjustment has an accuracy of 5 µm (0.2 mils).
Automatic front-to-back alignmentFront-to-back and multilayer alignment accuracy is enhanced by a camera vision system attached to the milling head which recognizes alignment fiducials embedded in the board layers. Once the fiducials are located the board can be removed, remounted, or flipped and it will always be properly aligned. This eliminates user interaction and simplifies the board alignment process.
Integrated vacuum table topAn integrated vacuum table top ensures that substrates are securely mounted on the plotter and remain perfectly flat during the milling process. The vacuum table eliminates substrate warping, which negates any milling depth deviations that might occur due to substrate unevenness.