The LPKF MicroLine 6000 P laser system meets these requirements by providing cost-effective industrial laser processing with highly precise results. The easy automation feature allows automatic execution of the entire process sequence.
The MicroLine 6000 P not only cuts rectangular boards but also drills holes and makes cuts along any contours. A vacuum table holds the boards securely in position. In the cutting process itself, there are practically no mechanical or thermal stresses on the component. A
vision system monitors the relative position of the laser to the board and noticeably helps increase the number of accepts.
Due to the integrated SMEMA interface, the LPKF MicroLine 6000P laser processing system easily combines with all types of handling systems.
Automatic Beam Correction
Active elements in the beam path continuously detect and optimize the position of the laser beam. This enables the LPKF MicroLine 6000 P to achieve optimal processing results, even after replacing components or changing ambient conditions. The processing power is also continuously detected and adapted to the chosen process parameters.
Integration in MES Solutions
The MicroLine 6000 P seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.
Material Position Detection
The vision system not only detects the contours of entire panels, but also detects contour features of individual components, increasing the chance of making components from deformed originals that still conform to standards.