LPKF MicroLine 6000 P

Laser Cutting of PCBs with High Performance and Low Costs

Products

Overview
Rapid PCB Prototyping
SMT Stencil Technology
PCB Processing Technology
- current page: MicroLine 6000 P
- MicroLine 1000 E
- Software
PCB Depaneling Technology
LDS
Solar Cell Technology
Precision Drives
Laser Welding
Measuring Machines

General

The LPKF MicroLine 6000 P is a laser system for cutting coverlayers, flexible printed circuits (FPCs) and printed circuit boards (PCBs) with high performance and low costs. With its depth-controlled cutting it is able to perform half-cut operations e.g. for decap applications of rigid-flex PCBs.

More application examples are: drilling of microvias in HDI circuit boards (high density interconnect circuit boards), structuring of TCO and ITO, laser removal of tin-resist, drilling of flex material, opening of solder-resist, as well as laser repair and rework of bare and assembled printed circuit boards.

The LPKF MicroLine 6000 P is characterized by its high flexibility. Only changing the layout data is necessary to modify the production parameters. The LPKF MicroLine 6000 P delivers unique throughput integrating a powerful UV laser source and a high speed linear positioning system.

Tooling costs for die-cutting can be eliminated. It can easily be integrated into the production line. Thanks to its advantages the investment in an LPKF MicroLine 6000 P pays for itself in a matter of months.

Pictures

The data handling is very convenient and reduces changeover time to a minimum. Parameters are easy to choose.

The system allows for transporting the applications via conveyor handling or by operating a loader/ unloader unit.

Detailed view of application transporting.

Rigid-Flex and Decap Applications: The system performs half-cut operations e.g. for decap applications of rigid-flex PCBs. Pockets for embedded components are created with superior edge quality.

Coverlayer Cutting: The laser system cuts arbitrary shapes and smaller apertures with virtually no mechanical stress on the foil, die misalignment, and contamination.

Cutting of FPCs and PCBs: The ability to cut complex shapes in a stress free process enables the placement of more circuits on a single panel while increasing the accuracy and reducing the burr formation.

Brochures

PCB Laser Cutting System