LPKF MicroLine 1000 E

Cutting of Cover Layers/
Depaneling Assembled and Unassembled PCBs

The LPKF MicroLine 1000 E is an economical laser system for depaneling assembled, unassembled printed circuit boards (PCBs) and for cover layer cutting. The benefits include shorter time to market and much higher cut-edge quality than conventional methods. The system cuts printed circuit boards with dimensions up to 229 x 305 millimeters.

The UV laser makes clean, burrless cuts in FR4, FR5, CEM, ceramic, polyimide, polyester and other printed circuit board substrates. It cuts substrates next to sensitive components and tracks without causing any mechanical stress. This reduces the number of rejects. Components can be placed right up to the cutting edge to save space and material. This enables small subassemblies with much higher assembly densities to be realized.

No clamping and fixation areas needed. The integrated vacuum table holds the materials firmly in place, and makes sure that flexible substrates remain flat and smooth.

Simple and Safe

Thanks to the preset process parameters, the LPKF MicroLine 1000 E operates at the press of a button. The optimal focus of the laser beam is adjusted automatically. The system uses fiducials to identify the positioning of the printed circuit boards and perfectly adjust the cutting process.

The LPKF MicroLine 1000 E is a compact Class 1 laser system. Its hood prevents accidents by stopping any dangerous manipulation when the laser is in operation. The hood also has a large window to enable the process to be monitored safely from outside.