The newly designed UV laser system, the LPKF MicroLine 1000 P, has been developed for a low cost entry into laser cutting of flex circuits and cover layers – laser precision with an excellent price/ performance ratio.
The UV laser cuts complex contours with tightest tolerances in flexible base material right from layout data. LPKF’s special exhaust system provides clean cuts and avoids pollution in the work environment. The MicroLine 1000 P produces virtually neither burr nor particles.
Furthermore the laser process eliminates operational cost and reduces changeover times. The integrated vacuum table holds the material in position. This sets a new benchmark in producing highest quality with lower unit costs and promotes a decision to utilize the LPKF MicroLine 1000 P system.
A new drift compensated scanning head and an automatic power stabilizing function based on two integrated power sensors – at the laser source and at substrate level – ensure the high process stability of the LPKF MicroLine 1000 P. An efficient vision system can even compensate for component tolerances.
Simplified Machine Control
The data handling is very convenient and reduces changeover time to a minimum. Parameters are easy to choose with intuitive menu-driven software running on a sturdy industrial touch-PC. All common data formats are supported.
Within a few moments the MicroLine 1000 P is ready to produce another design. UV-Laser cutting gives new freedom in production planning from prototyping to mass production – production on demand.
Coverlayer Cutting: The laser system cuts arbitrary shapes and smaller apertures with virtually no mechanical stress on the foil, die misalignment, and contamination.
LPKF MicroLine 1000P Application
Cutting of FPCs and PCBs: The ability to cut complex shapes in a stress free process enables the placement of more circuits on a single panel while increasing the accuracy and reducing the burr formation.