LPKF MicroLine 6000 S for stress-free depaneling of assembled boards. The LPKF MicroLine 6000 S is ideal for clean and particulate-free separation of single boards from a larger panel of flexible, thin rigid and rigid-flexible PCB materials. The system provides clean cuts in PI, FR4, FR5, and CEM materials. Further materials include polyesters, ceramics and other RF-materials. The novel production-ready design provides simple integration into the production line.
The laser cuts virtually any shape with minimal spaces between the single PCBs. The system features a clearance between the laser head and the working area surface of 30 mm, on a large area of 610 x 457 mm (24” x 18”). This allows for processing populated PCBs with surface mount devices (SMD) on both sides. The non-contact process prevents mechanical deformation – the laser beam singulates boards keeping delicate circuits safe. Micro cracks or delamination effects are no longer an issue, as well as dust/particles on the board or burr formations.
Further application examples are: drilling of microvias in HDI circuit boards, structuring of TCO/ITO, laser removal of tin-resist, drilling of flex material, opening of solder-resist, as well as laser repair and rework of bare and assembled PCBs.
Fast Return on Investment
The LPKF MicroLine 6000 S eliminates tooling expenses and costly fixtures for die-cutting and other conventional methods. Fast and simple set-up for a variety of products contributes to reduced production expenses. Due to the non-contact process, standard SMT carriers can be used throughout the whole production process. The focus spot of the laser beam is ideal for very narrow channel cuts, and very small radii. This saves space and material.