The LPKF MicroLine 1000 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The machine’s UV laser makes clean, burr-free cuts in FR4, FR5, CEM, ceramic, polyimide, polyester and other PCB substrates. The laser demonstrates its superiority over conventional cutting systems when handling flexible and very thin substrates in particular - all this in the price-range of a conventional cutting machine.
The UV laser will cut substrates even right next to delicate components and tracks without causing any mechanical stress. This allows small subassemblies with much higher assembly densities to be realized, even being populated right up to the edge of the printed circuit board. Another advantage of this stress-free method is the minimization of rejects due to outstanding CpK even at tightest tolerances.
Enhanced Processing Quality
The UV laser cuts PCBs with dimensions up to 250 x 350 millimeters. With a focus width of 20 μm, the beam cuts very narrow channels and copes with even the tightest radii. For a Secure cutting process laserpower measurement takes place at the laser source and at the PCB surface. Conversion times and time-to-market no longer depend on product-specific tools – just load the new layout data and the machine is ready to go.
Simple and Safe
Thanks to the specialized laser source and a compact control panel with touch screen and easy-to-use software, the LPKF MicroLine 1000 S operates at the push of a button. The optimal focus of the laser beam adjusts automatically. The system uses fiducials, boardedges or even individual break-out tabs to identify the position of the printed circuit boards.