LPKF MicroLine UV 3000

Laser system for cutting flex circuits and cover foils

The LPKF MicroLine UV 3000 has flexibility and capabilities of the LPKF MicroLine 600D with a smaller working area.

The laser system cuts precise openings in polyimide coverlayer foils and cuts flexible PCBs without stress or burrs. The combination of precision laser beam deflection with a high power laser source increase process speed and produce the most accurate results. The LPKF MicroLine UV 3000 features an extremely precise positioning system, permitting a more efficient use of the work surface of flex circuits and cover foils.

The LPKF MicroLine UV laser systems do not require specific tooling. In many cases, the amount of tooling costs that can be saved by using LPKF's laser covers the original invest very quickly.

The compact table concept results in a very small footprint. This allows the LPKF MicroLine UV 3000 system to fit in even more compact spaces.