LPKF MicroLine UV 3000i

Laser system for depaneling of populated boards

The LPKF MicroLine UV 3000i system is based on the LPKF MicroLine UV 3000. The UV laser system cuts flexible and rigid-flexible circuit boards as well as cover foils.

The LPKF Microline UV 3000i uses a unique exhaust and cutting configuration which allows for cutting with up to 30 mm between the substrate and the non-moving parts of the cutting system. Circuits populated with high SMD components can be cut easily. The non-contact process protects sensitive parts. The system is equipped with a handling interface and can be adapted to all kinds of handling options.

With a sealed housing and a small footprint, the system can be easily integrated into an existing production line.