The system writes the interconnect pattern onto an injection molded component from the CAD data. MicroLine3D users benefit from a system designed for cost-effective production of MIDs with the LPKF-LDS process.
The MicroLine3D laser system is also suitable for the 3D structuring of metal layers, cutting small flexible and rigid PCBs, and structuring ultra-fine circuits in copper clad or resists. It can also create abrasion resistant laser markings and engravings.
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