Products > LDS Equipment > MicroLine3D
LPKF MicroLine 3D

LPKF MicroLine3D

Production of 3D-MIDs
(Molded Interconnect Devices)

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The LPKF MicroLine3D is a laser system specially developed for the volume production of 3D-MIDs (molded interconnected devices).

The system writes the interconnect pattern onto an injection molded component from the CAD data. MicroLine3D users benefit from a system designed for cost-effective production of 3D-MIDs with the LPKF-LDS process.

The MicroLine3D laser system is also suitable for the 3D structuring of metal layers, cutting small flexible and rigid PCBs, and structuring ultra-fine circuits in copper clad or resists. It can also create abrasion resistant laser markings and engravings.

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LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90
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