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LPKF Fusion3D 1200

LPKF Fusion3D 1200

Flexible and efficient Production of 3D molded interconnect devices

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Description
The LPKF Fusion3D 1200 laser system has been developed as a flexible solution for a broad range of requirements for the laser direct structuring. Equipped with a rotary indexing table, small, medium and large series of 3D molded interconnect devices (MID) can be produced in a particularly economical fashion.

With different laser processing units, an optional vision system and optional turning devices on the rotary indexing table, the system can be adapted to the end customers layout and performance requirements.

Less non-productive time, easier loading

The integrated rotary indexing table reduces non-productive times: While a component is being processed, another one can already be loaded or unloaded. Each table side can handle a separate project. Thanks to the height control of the rotary indexing table, manufacturing errors during project changes can be prevented.

Both table sides feature four separate I/O ports and can be supplied with vacuum and compressed air. A light barrier provides an active access protection.

The modular laser concept allows the Fusion3D platform to be equipped with several processing units (PU). A maximum of three PUs can work simultaneously and thereby guarantee short cycle times.

Pictures
LPKF Fusion3D 1200
LPKF Fusion3D 1200 with rotary indexing table and vision system
LPKF Fusion3D 1200 structuring area
Structuring area up to 200 mm x 200 mm x 80 mm
Laser Direct Structuring of a 3D-MID
Laser Direct Structuring of 3D MIDs with up to three processing units


3D MID (Molded Interconnect Device)
Finger tips for a robot hand (Source: Citec, Bielefeld University)

Video



Technical Data
Fusion3D 1200

Laser class
1
Structuring area (X x Y x Z) 200 mm x 200 mm x 80 mm (7.8” x 7.8” x 3.1”)  or
100 mm x 100 mm x 40 mm (3.9” x 3.9” x 1.5”)
Number of processing units (PU) 1 - 3
Accuracy* ± 25 μm (±1 mil)
Max. structuring speed 4 000 mm/s (157'' per second)
Input data formats IGES, STEP
Software LPKF CircuitPro3D
Laser wavelength 1 064 nm
Laser pulse frequency 10 kHz - 200 kHz
Machine dimensions (W x H x D) 956 mm x 1 880 mm x 1 642 mm
(37.6’’ x 74’’ x 64.5’’)
Machine weight approx. 675 kg (1 488 lbs)**
Operating conditions
    Electric supply 400 V, 3L + N + PE, 16 A, 50/60 Hz, ~ 2.2 kVA
    Cooling air-cooled
    Ambient temperature 22° C ± 2.5° C (71.6° F ± 4° F)
    Humidity max. 60 %
Exhaust unit required; available as an option
Machinable materials (selection) Nickel, copper, stainless steel, LDS plastics, powder coatings and LDS paint, gold and silver paste, ceramic, tin

* Calibrated scanfield
** Including 3 Processing Units (PU), ecluding exhaust unit




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