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LPKF Fusion3D 1100

LPKF Fusion3D 1100

Laser Direct Structuring of
3D circuit carriers

Description
The LPKF Fusion3D 1100 laser structurer lowers the price threshold for entering the 3D interconnect device market. The large working platform with z-axis travel is excellent for prototyping, and can also be used to produce small and medium batches. It can be used for manufacturing small and medium volumes or for prototyping without removing high-volume systems from production.

Preview Movie



The basic version of the LPKF Fusion3D 1100 features a large, heightadjustable work surface to which the customer’s fixtures can be attached. A pilot laser helps align the components.

Built-In Flexibility

The LPKF Fusion3D 1100 features a solid granite base and casters that allow it to be easily moved around. This design combines efficient components with a compact design suitable for lab use.

Proven Technology

The LPKF Fusion3D 1100 uses the same laser processing unit as the mass-production system, the LPKF Fusion3D 6000. The CAM software, production parameters and structuring area are identical and the parameters detected by the Fusion3D 1100 can be copied directly to the production system.

Converting Data with Ease

The data acquisition and processing of structuring jobs is carried out by LPKF CircuitPro 3D software, which interprets data and optimizes the structuring process. Complex layouts can be split into individual sub-projects to allow laser-structuring in different angular positions.

Pictures
The Fusion3D 6000 laser unit is also incorporated in the entry-level system
Fusion 3D 1100
The compact system can be flexibly positioned thanks to the rollers.
Tracks are created as surfaces in the 3D-CAD program

Fusion3D 1100
LPKF Fusion3D 1100
A component being laser structured.

Technical Data
Technical Data: Fusion3D 1100
Laser safety class 1
Structuring area (X/Y/Z) 160 mm x 160 mm x 80 mm (6.3” x 6.3” x 3.2”)
Number of processing units (PU) 1 - 3
Fixturing base plate 413 mm x 730 mm (16’’ x 28’’)
Accuracy* ± 25 μm (±1 mil)
Max. structuring speed 4 000 mm/s (157'' per second)
Input data formats IGES, STEP
Software LPKF CircuitPro 3D
Laser wavelength 1 064 nm
Laser pulse frequency 10 kHz – 200 kHz
Machine dimensions (W x H x D) 921 mm x 1 880 mm x 1 441 mm (36’’ x 74’’ x 57’’)
Machine weight approx. 550 kg (1 200 lbs), excluding exhaust unit
Operating conditions
    Electric supply 230 V single phase, 50/ 60 Hz, ~1.5 kVA
    Cooling air-cooled
    Ambient temperature 22° C ± 2.5° C (71.6° F ± 4° F)
    Humidity max. 70 %
Exhaust unit required; available as an option
Machinable materials (selection) Nickel, copper, stainless steel, LDS plastics, powder coatings and LDS paint, gold and silver paste, ceramic, tin


* Laser positioning accuracy for the processing unit.
Optional: 10 port I/O interface for possibility to add automation. Automation equipment ist not provided by LPKF.

 
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More information


                                       
LPKF Laser & Electronics AG  •  Osteriede 7  •  30827 Garbsen  •  Germany  •  Tel.: +49 (0) 5131 7095-0  •  Fax: +49 (0) 5131 7095-90

 
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