LPKF MicroLine 3D

Producing 3D molded interconnected devices

The LPKF MicroLine 3D is a laser system specially developed for the volume production of molded interconnected devices (MIDs).

The system writes the interconnect pattern onto an injection molded component from the CAD data. MicroLine 3D users benefit from a system designed for cost-effective production of MIDs with the LPKF-LDS process.

The MicroLine 3D laser system is also suitable for the 3D structuring of metal layers, cutting small flexible and rigid PCBs, and structuring ultra-fine circuits in copper clad or resists. It can also create abrasion resistant laser markings and engravings.